Detection of wafer-edge defects
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United States of America Patent
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Jul 15, 2014
Grant Date -
Feb 14, 2013
app pub date -
Aug 9, 2012
filing date -
Aug 11, 2011
priority date (Note) -
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Abstract
Apparatus for inspection of a disk, which includes a crystalline material and has first and second sides. The apparatus includes an X-ray source, which is configured to direct a beam of X-rays to impinge on an area of the first side of the disk. An X-ray detector is positioned to receive and form input images of the X-rays that are diffracted from the area of the first side of the disk in a reflective mode. A motion assembly is configured to rotate the disk relative to the X-ray source and detector so that the area scans over a circumferential path in proximity to an edge of the disk. A processor is configured to process the input images formed by the X-ray detector along the circumferential path so as to generate a composite output image indicative of defects along the edge of the disk.
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