Method to provide microstructure for encapsulated high-brightness LED chips
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United States of America Patent
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Jul 15, 2014
Grant Date -
May 12, 2011
app pub date -
Nov 5, 2010
filing date -
Nov 5, 2009
priority date (Note) -
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Abstract
Encapsulated LEDs can be made by taking a mold tool defining a cavity that defines a lens shape and providing a patterned release film defining the inverse of a microstructure in a surface of the film. The patterned release film is conformed to the cavity of the mold tool. An LED chip is placed in a spaced relationship from the patterned release film in the cavity. A resin is then introduced into the space between the LED chip and the patterned release film in the cavity. The resin is cured in the space between the LED chip and the patterned release film in the cavity while contact is maintained between the patterned release film and the curing resin. The encapsulated LED is then freed from the mold tool and the patterned release film.
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