Method of inspecting and processing semiconductor wafers
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United States of America Patent
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Jul 15, 2014
Grant Date -
Jun 7, 2012
app pub date -
Aug 16, 2010
filing date -
Aug 17, 2009
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Abstract
A wafer inspection method comprises imaging a full surface of the wafer at an imaging resolution insufficient to resolve individual microstructures which are repetitively arranged on the wafer. A mask 109 is applied to the recorded image and unmasked portions 111 of the image are further processed by averaging. The unmasked portions 111 are selected such that they include memory portions of the wafer.
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