Method and apparatus for applying solder to a work piece
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United States of America Patent
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Jul 15, 2014
Grant Date -
Aug 25, 2011
app pub date -
Feb 23, 2011
filing date -
Feb 23, 2010
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Abstract
The invention concerns a method and an apparatus for the application of solder onto a work piece, wherein the solder is soldered on at a soldering temperature TL and subject to the influence of ultrasound. In order to be able to solder without difficulties the solder onto work pieces that exhibit sensitivity to breakage it is proposed that the solder is heated, is applied to the work piece that is supported in particular in a spring-mounted manner, and is soldered-on subject to the influence of ultrasound.
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