Mounting system for applying an RFID chip module to a substrate, in particular a label
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United States of America Patent
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Jul 15, 2014
Grant Date -
Mar 28, 2013
app pub date -
Nov 30, 2010
filing date -
Feb 6, 2010
priority date (Note) -
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status (Latency Note)
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Abstract
A mounting system for applying an RFID chip module having at least one electrical connection to a substrate having at least one conductor, in particular a label. The system includes a stamping device for stamping out the RFID chip module from a carrier strip having a plurality of chip modules. The stamping device comprises a stamping die having a stamping opening, by which an RFID chip module to be stamped out is received with accurate positioning, and a stamping punch is disposed above the stamping opening A support for receiving a substrate with accurate positioning is disposed below the stamping opening and the stamping punch can be moved up against the substrate. A suction device is provided for holding the RFID chip module on the stamping punch. A heating device for melting solder is present on the RFID chip module in order to establish a conductive connection between an electrical connection of the RFID chip module and a conductor of the substrate.
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