Semiconductor integrated circuit device
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United States of America Patent
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Jul 8, 2014
Grant Date -
Nov 15, 2012
app pub date -
Jul 16, 2012
filing date -
Feb 22, 2010
priority date (Note) -
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Abstract
An electrode pad is provided above a circuit block of a semiconductor integrated circuit device. A junction point A and a junction point B are provided on connection lines connecting electrode pads to an internal circuit and an electrostatic discharge (ESD) protection circuit. The junction point A and the junction point B are positioned at locations closer to the ESD protection circuit than to the electrode pads.
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