Signal amplification by hierarchal resonating structures
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United States of America Patent
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Jul 8, 2014
Grant Date -
May 26, 2011
app pub date -
Oct 11, 2007
filing date -
Oct 11, 2007
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Abstract
An electromechanical resonating structure, including: first level major elements coupled to each other to form a second or higher level hierarchy; and first level sub-micron size minor elements with a characteristic frequency and coupled to each of the first level major elements to form a second level hierarchy in which a signal is effectively amplified by vibrating each of the plurality of major elements in at least one mode determined by the geometry and dimensions of the first level sub-micron minor elements.
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