Ion implantation method and ion implantation apparatus

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United States of America Patent

PATENT NO 8772741
APP PUB NO 20120252194A1
SERIAL NO

13432936

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Abstract

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An ion implantation method includes reciprocally scanning an ion beam, mechanically scanning a wafer in a direction perpendicular to a beam scanning direction, and implanting ions into the wafer. The wafer is divided into a plurality of implantation regions, a beam scanning speed in the beam scanning direction is set to be varied for each of the implantation regions, an ion implantation amount distribution for each of the implantation regions is controlled by changing and controlling the beam scanning speed, and the ion implantation amount for each of the implantation regions is controlled and a beam scanning frequency and a beam scanning amplitude in the control of the beam scanning speed for each of the implantation regions is made to be constant by setting a wafer mechanical scanning speed and controlling the wafer mechanical scanning speed for each of the implantation regions.

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Patent Owner(s)

Patent OwnerAddress
SEN CORPORATIONTOKYO JAPAN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kimura, Yasuhiko Tokyo, JP 20 153
Ninomiya, Shiro Tokyo, JP 20 444
Ochi, Akihiro Tokyo, JP 11 47
Okamoto, Yasuharu Tokyo, JP 9 32
Yumiyama, Toshio Tokyo, JP 9 70

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