Ion implantation method and ion implantation apparatus

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United States of America Patent

PATENT NO 8772142
APP PUB NO 20120244691A1
SERIAL NO

13426423

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Abstract

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An ion implantation method includes reciprocally scanning an ion beam, mechanically scanning a wafer in a direction perpendicular to the ion beam scanning direction, implanting ions into the wafer, and generating an ion implantation amount distribution in a wafer surface of an isotropic concentric circle shape for correcting non-uniformity in the wafer surface in other semiconductor manufacturing processes, by controlling a beam scanning speed in the ion beam scanning direction and a wafer scanning speed in the mechanical scanning direction at the same time and independently using the respective control functions defining speed correction amounts.

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Patent Owner(s)

Patent OwnerAddress
SEN CORPORATIONTOKYO JAPAN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kudo, Tetsuya Tokyo, JP 22 70
Ninomiya, Shiro Tokyo, JP 20 444
Ochi, Akihiro Tokyo, JP 11 47

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