Wafer scale spatial power combiner
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jul 1, 2014
Grant Date -
Jan 5, 2012
app pub date -
Jul 5, 2011
filing date -
Jul 2, 2010
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A plurality of power amplifiers are integrated into a semiconductor substrate and coupled to a corresponding first plurality of antennas on an adjacent first microwave substrate. A second microwave substrate carries a second plurality of antennas coupled to a combining network. The second microwave substrate is separated from the first microwave substrate to allow a free space combination of RF energy propagated by the first plurality of antennas.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully