Through silicon via-based oscillator wafer-level-package structure and method for fabricating the same
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United States of America Patent
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Jul 1, 2014
Grant Date -
Oct 31, 2013
app pub date -
Jun 22, 2012
filing date -
Apr 27, 2012
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Abstract
The present invention provides a TSV-based oscillator WLP structure and a method for fabricating the same. The method of the present invention comprises steps: providing a silicon base having an oscillator unit disposed thereon; forming on the silicon base at least one package ring surrounding the oscillator unit; and disposing a silicon cap on the package ring to envelop the oscillator unit. The present invention adopts a cap and a base, which are made of the same material, to effectively overcome the problem of thermal stress occurring in a conventional sandwich package structure. Further, the present invention elaborately designs the wiring on the lower surface of the base to reduce the package size and decrease consumption of noble metals.
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