Integration of piezoelectric materials with substrates
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United States of America Patent
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Jul 1, 2014
Grant Date -
Dec 2, 2010
app pub date -
Mar 31, 2010
filing date -
Mar 31, 2009
priority date (Note) -
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Abstract
Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer.
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