Package structure
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United States of America Patent
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Jul 1, 2014
Grant Date -
Jun 21, 2012
app pub date -
Sep 1, 2009
filing date -
Sep 1, 2009
priority date (Note) -
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status (Latency Note)
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Abstract
The invention discloses a package structure including a semiconductor device, a first protection layer, a second protection layer and at least one conductive connector. The semiconductor device has at least one pad. The first protection layer is disposed on the semiconductor device and exposes the pad. The second protection layer, disposed on the first protection layer, has at least one first opening and at least one second opening. The first opening exposes a partial surface of the pad. The second opening exposes a partial surface of the first protection layer. The conductive connector, opposite to the pad, is disposed on the second protection layer and coupled to the pad through the first openings.
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