Method for metallization or metallization and interconnection of back contact solar cells
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United States of America Patent
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Jul 1, 2014
Grant Date -
Sep 19, 2013
app pub date -
Sep 28, 2012
filing date -
Mar 19, 2012
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Abstract
The present invention relates to cost effective methods for metallization and or metallization and interconnection of high efficiency silicon based back-contacted back-junction solar panels and solar panels thereof having a multiplicity of alternating rectangular emitter- and base regions on the back-side of each cell, each with rectangular metallic electric finger conductor above and running in parallel with the corresponding emitter- and base region, a first insulation layer in-between the wafer and finger conductors, and a second insulation layer in between the finger conductors and cell interconnections.
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