Process and device for form locked joining of two components

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8759710
APP PUB NO 20070204954A1
SERIAL NO

11747588

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A process is described for form locking joining of two components through plastic deformation of one of the two components. In order for the tool for forming the form locking connection not to get in direct contact with the plasticized area of the joining partners, a third component between the tool and the two components to be joined through form locking is being used, which simultaneously enters into an adhesive bond with one of the two components to be joined through form locking. The thermal energy for creating the plastic state of one of the joining partners and for developing the adhesive bond is applied through electromagnetic radiation through the third component.

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Patent Owner(s)

Patent OwnerAddress
LPKF LASER & ELECTRONICS AG30827 GARBSEN

International Classification(s)

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  • 2007 Application Filing Year
  • B23K Class
  • 851 Applications Filed
  • 575 Patents Issued To-Date
  • 67.57 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances2007200820092010201120122013201420152016201720180255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Brunnecker, Frank Memmelsdorf, DE 8 51
Hofmann, Alexander Erlangen, DE 73 221

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Patent Citation Ranking

  • 6 Citation Count
  • B23K Class
  • 10.94 % this patent is cited more than
  • 11 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges10765112951219611201 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 80100 +050100150200250300350400450500550600650700

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11.5 Year Payment $7400.00 $3700.00 $1850.00 Dec 24, 2025