Manufacturing and use of microperforated substrates

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United States of America Patent

PATENT NO 8759707
APP PUB NO 20080047935A1
SERIAL NO

10594991

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Abstract

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This invention relates to methods and devices for the production of micro-structured substrates and their application in natural sciences and technology, in particular in analysis and detection systems based on artificial and biological lipid membranes. The structure is preferably a hole or a cavity or channel and is obtained by spark perforation. Energy, preferably heat, is applied to the region to be structured so as to reduce the amplitude of voltage required and/or soften the material. The electrical parameters of the spark perforation are feedback-controlled.

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Patent Owner(s)

Patent OwnerAddress
AGC INCCHIYODA-KU TOKYO 100-8405

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Schmidt, Christian Epalinges, CH 142 944

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