Neutral ligand containing precursors and methods for deposition of a metal containing film
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United States of America Patent
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Jun 24, 2014
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app pub date -
Sep 17, 2008
filing date -
Sep 17, 2007
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Abstract
Methods and compositions for depositing metal films are described herein. In general, the disclosed methods utilize precursor compounds comprising gold, silver or copper. More specifically, the disclosed precursor compounds utilize neutral ligands derived from ethylene or acetylene.
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