Cluster type semiconductor processing apparatus
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United States of America Patent
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Jun 24, 2014
Grant Date -
Sep 4, 2008
app pub date -
Mar 2, 2007
filing date -
Mar 2, 2007
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Abstract
A cluster type semiconductor processing apparatus includes a wafer handling chamber having a polygonal base including multiple sides for wafer processing chambers and two adjacent sides for wafer loading/unloading chambers as viewed in a direction of an axis of the wafer handling chamber. An angle A between two adjacent sides of the multiple sides for wafer processing chambers is greater than an angle B which is calculated by dividing 360° by the number of the total sides consisting of the multiple sides for wafer processing chambers and the two adjacent sides for wafer loading/unloading chambers.
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