Silicon wafer and method for manufacturing the same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jun 24, 2014
Grant Date -
Jul 15, 2010
app pub date -
Mar 22, 2010
filing date -
Jul 22, 2004
priority date (Note) -
In Force
status (Latency Note)
Importance
Loading Importance Indicators... 
Abstract
A method for manufacturing a silicon wafer includes a step of annealing a silicon wafer which is sliced from a silicon single crystal ingot, thereby forming a DZ layer in a first surface and in a second surface of the silicon wafer and a step of removing either a portion of the DZ layer in the first surface or a portion of the DZ layer in the second surface.
First Claim
Other Claims data not available
Family
Loading Family data...
International Classification(s)
- 2010 Application Filing Year
- C30B Class
- 269 Applications Filed
- 218 Patents Issued To-Date
- 81.05 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 0 Citation Count
- C30B Class
- 0 % this patent is cited more than
- 11 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Dec 24, 2025 |
