Inspection method and device

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8754664
APP PUB NO 20130112871A1
SERIAL NO

13810512

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Abstract

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The high magnification, high resolution and real-time property of an SEM image are realized when the electrical characteristics of an inspection object are measured, without affecting the electrical characteristics of the inspection object. A high-quality, high-magnification first image including an image of a target position in the inspection object on a sample is acquired. Next, a low-quality, low-magnification second image including the image of the target position in the inspection object on the sample and probe images is acquired. Next, data on the first image is built into the second image to generate an image for coarse-access observation which is the same in magnification as the second image. The generation of the image for coarse-access observation is repeated until a probe comes close to the target position in the inspection object.

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Patent Owner(s)

Patent OwnerAddress
HITACHI HIGH-TECH CORPORATIONMINATO-KU TOKYO 105-6409

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ando, Tohru Tokyo, JP 21 95
Nara, Yasuhiko Hitachinaka, JP 51 566

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