Wafer-level interconnect for high mechanical reliability applications

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United States of America Patent

PATENT NO 8754524
SERIAL NO

13397876

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Abstract

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An interconnect structure comprises a solder including nickel (Ni) in a range of 0.01 to 0.20 percent by weight. The interconnect structure further includes an intermetallic compound (IMC) layer in contact with the solder. The IMC layer comprises a compound of copper and nickel.

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Patent Owner(s)

Patent OwnerAddress
HUATIAN TECHNOLOGY(KUNSHAN) ELECTRONICS CO LTD112 LONGTENG ROAD ECONOMIC & TECHNICAL DEVELOPMENT ZONE KUNSHAN JIANGSU 215300

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Burgess, Guy F Gilbert, US 9 65
Curtis, Anthony Gilbert, US 7 108
Johnson, Michael Tempe, US 191 3954
Lu, Yuan Phoenix, US 82 691
Tessier, Ted Chandler, US 2 23

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