Process and installation for depositing films onto a substrate
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United States of America Patent
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Jun 17, 2014
Grant Date -
Jul 28, 2011
app pub date -
Jul 16, 2009
filing date -
Jul 16, 2008
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Abstract
A process for depositing a film onto a substrate (2), which comprises in particular introducing a substrate (2) into a reaction chamber (6, 106, 206), in which at least two electrodes (10, 110, 210) are placed. A high-frequency electrical voltage is generated, said voltage being such that it generates filamentary plasma (12, 112, 212) between the two electrodes (10, 110, 210). An adjustable inductor (L) placed in parallel with the inductor of the installation generating the electrical voltage is employed so as to reduce the phase shift between the voltage and the current generated and to increase the time during which the current flows in the plasma (12, 112, 212).
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