Integrated circuit with improved transmission line structure and electromagnetic shielding between radio frequency circuit paths
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United States of America Patent
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Jun 10, 2014
Grant Date -
Jun 10, 2010
app pub date -
Dec 1, 2009
filing date -
Dec 5, 2008
priority date (Note) -
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Abstract
An integrated circuit is disclosed having through silicon vias spaced apart one from another and conductors, each coupled to one or more of the through silicon vias, the conductors in aggregate in use forming a segmented conductive plane maintained at a same potential and forming an electromagnetic shield.
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