Printed board assembly interface structures
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United States of America Patent
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Jun 10, 2014
Grant Date -
Jan 10, 2013
app pub date -
Jul 8, 2011
filing date -
Jul 8, 2011
priority date (Note) -
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Abstract
Example printed board assembly (PBA) interfaces are described. In some examples, the disclosure relates to a printed board (PB) including a conductive layer, where the PB defines a first surface and a recess in the first surface, where a surface defining the recess is at least one of electrically or thermally connected to the conductive layer, and an electrical component body mounted on the PB. The electrical component body may be mounted on the PB such that a surface of the electrical component body extends over at least a portion of the recess, where the recess extends beyond the electrical component body such that the recess defines an aperture for introducing an interface material between the surface of the electrical component body and the surface of the recess.
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