Patterning method
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United States of America Patent
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Jun 10, 2014
Grant Date -
Jan 7, 2010
app pub date -
Jul 7, 2008
filing date -
Jul 7, 2008
priority date (Note) -
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Abstract
A patterning method is provided. First, a substrate having an objective material layer thereon is provided. Thereafter, a mask layer is formed on the objective material layer. Afterwards, a patterned layer is formed over the mask layer, wherein a material of the patterned layer includes a metal-containing substance. Then, the mask layer is patterned to form a patterned mask layer. Further, the objective material layer is patterned, using the patterned mask layer as a mask.
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