Precursor for formation of europium-containing thin film, and method for forming europium-containing thin film

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United States of America Patent

PATENT NO 8747965
APP PUB NO 20140024814A1
SERIAL NO

14007474

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Abstract

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Provided are a novel europium compound which has a melting point of 180° C. or lower and can be stably supplied by bubbling in a chemical vapor deposition method or an atomic layer deposition method, a precursor for forming a europium-containing thin film based on the compound, and a method for forming a europium-containing thin film using this precursor. A europium-containing thin film is formed using bis(tetramethylmonoalkylcyclopentadienyl)europium as a precursor for forming a europium-containing thin film by a chemical vapor deposition method or anatomic layer deposition method.

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Patent Owner(s)

Patent OwnerAddress
KABUSHIKIKAISHA KOJUNDOKAGAKU KENKYUSHO5-1-18 CHIYODA SAKADO-SHI SAITAMA 350-0284

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Higashi, Shintaro Sakado, JP 11 32
Kikukawa, Kaoru Sakado, JP 1 3
Kuboshima, Yoshinori Sakado, JP 6 31
Mogi, Takayuki Sakado, JP 13 441

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