Superfilling secondary metallization process in MEMS fabrication
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United States of America Patent
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Jun 10, 2014
Grant Date -
May 5, 2011
app pub date -
Oct 29, 2009
filing date -
Oct 29, 2009
priority date (Note) -
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Abstract
Processes are provided herein for the fabrication of MEMS utilizing both a primary metal that is integrated into the final MEMS structure and a sacrificial secondary metal that provides structural support for the primary metal component during machining. More specifically, techniques are disclosed to increase the rate of secondary metal deposition between primary metal features in order to prevent voiding in the sacrificial secondary metal and thus enhance structural support of the primary metal during machining.
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