Method for applying soft solder to a mounting surface of a component
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United States of America Patent
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Jun 10, 2014
Grant Date -
Nov 29, 2012
app pub date -
Feb 22, 2011
filing date -
Feb 23, 2010
priority date (Note) -
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Abstract
The invention relates to a method for applying soft solder to a mounting surface of a component, wherein a connecting means comprising a carrier layer and a soft solder layer formed by physical vapor deposition on the carrier layer is brought into mechanical contact between the soft solder layer and the mounting surface, such that a first bond strength between the soft solder layer and the mounting surface is greater than a second bond strength between the soft solder layer and the carrier layer. The connecting means is subsequently removed from the component so that the carrier layer releases from the soft solder layer in the area of the mounting surface and thus soft solder remains only at the mounting surface.
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