Process for fabricating an ultra-low-resistance superconducting joint having high shielding characteristics
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United States of America Patent
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Jun 10, 2014
Grant Date -
Jan 10, 2013
app pub date -
Jun 30, 2010
filing date -
Mar 12, 2010
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Abstract
A process for fabricating an ultra-low-resistance superconducting joint that has high shielding characteristics. The process includes: corroding copper on the outer surface at the end of a NbTi/Cu superconducting wire to form terminal NbTi superconducting filaments; inserting same number of NbTi superconducting filaments into each through hole of the niobium layer of a Nb/NbTi/Cu multilayer composite rod; pressing at the outside of the Nb/NbTi/Cu multilayer composite rod to combine the Nb/NbTi/Cu multilayer composite rod and NbTi superconducting filaments together to form a joint; and inserting the joint into a YBCO tube, and then filling the YBCO tube with molten bismuth-lead-tin-cadmium (BiPbSnCd) alloy solder to form a superconducting joint with high shielding and low resistance characteristics.
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