Apparatus for improved power distribution or power dissipation to an electrical component and method for the same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jun 3, 2014
Grant Date -
Nov 4, 2010
app pub date -
Jan 8, 2010
filing date -
May 4, 2009
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Embedding a power modification component such as a capacitance inside of an adaptor board located to extend over and beyond the vias of the main circuit board so that a portion of the interposer board containing the embedded capacitance is located beyond where the vias or blinds are located. This permits that via to conduct through the opening. In this way, the capacitance and the resistance will have a closer contact point to the electrical component. A resistance can also be embedded in an opening in the adaptor board and be vertically aligned within the opening to make contact with a pad on top of the adaptor board and a pad at the bottom of the adaptor board so that electricity conducts through the embedded component.
First Claim
Other Claims data not available
Family
International Classification(s)
- 2010 Application Filing Year
- H05K Class
- 3964 Applications Filed
- 1999 Patents Issued To-Date
- 50.43 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 2 Citation Count
- H05K Class
- 6.56 % this patent is cited more than
- 11 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Dec 3, 2025 |
