Diode array and method for producing a diode array
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United States of America Patent
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Jun 3, 2014
Grant Date -
Sep 13, 2012
app pub date -
Sep 15, 2010
filing date -
Sep 17, 2009
priority date (Note) -
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Abstract
A diode arrangement includes a diode and two electrodes. Each electrode is connected to the diode in an electrically conductive manner via a soldered connection on one of two oppositely arranged contact surfaces of the diode. The contact surfaces of the diode are formed substantially by the surfaces of a lower side and an upper side of the diode and are contacted with the contact extensions of the electrodes via the soldered connection. The contact extensions forming counter contact surfaces are substantially congruent with the contact surfaces of the diode.
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