Bonding inspection structure

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8736083
APP PUB NO 20100163869A1
SERIAL NO

12431766

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Abstract

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A bonding inspection structure is provided. The bonding inspection structure includes at least a elastic bump located on a substrate. At least an opening is formed in the top portion of the elastic bump. An inspection area of the top portion of the elastic bump is larger than an area of the opening.

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Patent Owner(s)

Patent OwnerAddress
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTENO 195 SEC 4 CHUNG HSING RD CHUTUNG HSINCHU 31040
AU OPTRONICS CORPORATIONNO 1 LI-HSIN RD II SCIENCE-BASED INDUSTRIAL PARK HSINCHU
HANNSTAR DISPLAY CORPORATION4F NO 15 LN 168 XINGSHAN RD NEIHU DIST TAIPEI CITY 114762
CHUNGHWA PICTURE TUBES LTDNO 1 HUAYING RD LONGTAN DIST TAOYUAN CITY 325
CHI MEI OPTOELECTRONICS CORPORATIONTAIWAN 74147
TAIWAN TFT LCD ASSOCIATIONHSINCHU

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
An, Chao-Chyun Hsinchu, TW 7 75
Lee, Hsiao-Ting Nantou County, TW 2 6
Yang, Sheng-Shu Hsinchu, TW 16 120

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