Circuit board and mounting structure using the same
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United States of America Patent
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May 27, 2014
Grant Date -
May 31, 2012
app pub date -
Nov 21, 2011
filing date -
Nov 29, 2010
priority date (Note) -
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Abstract
A circuit board comprises a substrate; a through hole penetrating the substrate along with a direction of a thickness thereof; and a through hole conductor covering an inner wall of the through hole. The substrate comprises a first fiber layer, a second fiber layer, and a resin layer arranged between the first fiber layer and the second fiber layer. Each of the first fiber layer and the second fiber layer has a plurality of fibers and a resin arranged among the plurality of the fibers. The resin layer contains a resin and doesn't contain a fiber. The inner wall of the through hole, in a cross-section view along with the direction of the thickness of the substrate, comprises a curved depression in the resin layer.
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