Flexible circuit board
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United States of America Patent
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Sep 16, 2014
Grant Date -
May 31, 2012
app pub date -
Sep 16, 2011
filing date -
Sep 16, 2011
priority date (Note) -
Withdrawn
status (Latency Note)
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Abstract
In a flexible circuit board, signal wirings and ground wirings are provided on one main surface of a base film formed of a thermoset resin. A coverlay film formed of a thermoplastic resin is adhered to and integrated with the signal wirings, ground wirings, and base film. External terminals 15 are disposed in a predetermined conductor pattern on one main surface of the coverlay film, and a plated layer is formed on each of the external terminals. A first ground layer and a rear side resin film are adhered in this order below the base film to be integrated.
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