Method of cutting out chips for a plurality of sensor elements from laminated body, method of manufacturing sensor element, and sensor element
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United States of America Patent
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May 27, 2014
Grant Date -
Sep 24, 2009
app pub date -
Mar 18, 2009
filing date -
Mar 19, 2008
priority date (Note) -
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Abstract
A sensor element is formed by cutting a laminated body and heating with the cutting taking place in a state where a difference in resistance on sides of a cutting component is as small as possible. That is, a uniform cutting is where resistance added to both sides of the cutting component is substantially the same. When uniform cutting cannot be performed, a nonuniform cutting in a state where resistance added to both sides of the cutting component is different is performed. Consequently, a surface perpendicular to a longitudinal direction of the sensor element is trapezoidal.
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