Apparatus and method for the production of semiconductor material foils
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United States of America Patent
Stats
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May 27, 2014
Grant Date -
Jan 17, 2013
app pub date -
Feb 8, 2011
filing date -
Feb 8, 2010
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A casting device for producing semiconductor material foil includes a casting frame and a substrate band. The casting frame is arranged for holding a molten semiconductor material and includes sidewalls of which an exit sidewall is located at an output position for the semiconductor material foil. The exit side wall is provided with an exit slit. The casting device further includes a local force exerting means to exert at the location of the exit slit a locally enlarged external force on the molten semiconductor material to enlarge an outer pressure on the molten material at the exit slit.
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International Classification(s)
- 2011 Application Filing Year
- B22D Class
- 350 Applications Filed
- 249 Patents Issued To-Date
- 71.15 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 0 Citation Count
- B22D Class
- 0 % this patent is cited more than
- 11 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Nov 27, 2025 |
