Solution processing method for forming electrical contacts of organic devices
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United States of America Patent
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May 20, 2014
Grant Date -
Dec 22, 2011
app pub date -
May 12, 2011
filing date -
Nov 17, 2008
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Abstract
A method for forming, on an organic semiconductor layer, an electrical contact layer comprising a metal, is disclosed. In one aspect, the method includes providing a charge collecting barrier layer on the organic semiconductor layer, providing a liquid composition comprising a precursor for the metal on the charge collecting barrier layer, and performing a sintering process. The charge collecting barrier layer is substantially impermeable to the components of the liquid composition.
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