Sensor assembly
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United States of America Patent
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May 20, 2014
Grant Date -
Mar 5, 2009
app pub date -
Apr 24, 2008
filing date -
Apr 27, 2007
priority date (Note) -
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Abstract
The invention relates to a sensor assembly comprising a first electronic wiring substrate having a first and a second surface and at least one analyte sensor formed on the first surface thereof, the at least one analyte sensor being connected with one or more electrical contact points, a second electronic wiring substrate having a first and a second surface and at least one analyte sensor formed on the first surface part thereof, the at least one analyte sensor being connected with one or more electrical contact points, and a spacer having a through-going recess with a first and a second opening, wherein the first substrate, the second substrate and the spacer are arranged in a layered structure, where the first surface of the first substrate closes the first opening of the spacer and the first surface of the second substrate closes the second opening of the spacer, thereby forming a measuring cell which is faced by at least one sensor from each of the substrates.
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