Molding die set and resin molding apparatus having the same
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United States of America Patent
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May 20, 2014
Grant Date -
Jan 31, 2013
app pub date -
Jan 30, 2012
filing date -
Jul 29, 2011
priority date (Note) -
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Abstract
The molding die set includes: a first molding die having a first molding chase, a cavity piece, supported by the first molding chase, movably supported by the first molding chase and enclosing the cavity piece; a second molding die having a second molding chase, a work supporting section biased and supported by the second molding chase and on which a work will be mounted, and a center insert located adjacent to the work supporting section; and a pot being provided to one of the first molding die and the second molding die, the pot feeding resin for molding the work. The second molding die has a thickness adjusting mechanism, which makes the work supporting section absorb thickness variation of the work and brings the work into contact with the movable clamper when the work is clamped with the movable clamper of the first molding die.
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