Apparatus for object processing
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United States of America Patent
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May 20, 2014
Grant Date -
Apr 7, 2011
app pub date -
May 6, 2008
filing date -
May 7, 2007
priority date (Note) -
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Abstract
The present invention provides apparatuses for processing an object just as semiconductor chips and dies. The first embodiment comprises two or more pick and place heads (FIG. 1) which operate sequentially (ie leap frog) to pick components from a first location to a second. The second embodiment (FIG. 8) comprises a flipping head combined with a pick and place heads where an object is picked up by the flipping head, turned over and then presented to a pick and place head for relocation to an output.
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