Laser soldering using thermal characteristics
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United States of America Patent
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May 13, 2014
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N/A
app pub date -
Jan 9, 2007
filing date -
Jan 10, 2006
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Abstract
In this soldering method, a laser is directed onto an end face of the stack in such a manner that the laser heats the stack. At least one parameter of the laser is adjusted to a value that is the image by a mathematical model of at least one thermal characteristic of the stack. The parameter of the laser is a parameter selected from an irradiation duration, a surface area of the end face of the stack that is irradiated by the laser, and an irradiating power of the laser.
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