Circuit materials with improved bond, method of manufacture thereof, and articles formed therefrom

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United States of America Patent

PATENT NO 8722192
APP PUB NO 20130034725A1
SERIAL NO

13649333

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Abstract

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A circuit material, comprising a conductive metal layer or a dielectric circuit substrate layer and an adhesive layer disposed on the conductive metal layer or the dielectric substrate layer, wherein the adhesive comprises a poly(arylene ether) and a polybutadiene or polyisoprene polymer.

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Patent Owner(s)

Patent OwnerAddress
WORLD PROPERTIES INCILLINOIS AMERICA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Paul, Sankar K Branford, US 11 159

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