Tin-based solder ball and semiconductor package including the same
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United States of America Patent
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May 6, 2014
Grant Date -
Jul 11, 2013
app pub date -
Dec 13, 2012
filing date -
Dec 14, 2011
priority date (Note) -
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Abstract
A tin (Sn)-based solder ball and a semiconductor package including the same are provided. The tin-based solder ball includes about 0.2 to 4 wt. % silver (Ag), about 0.1 to 1 wt. % copper (Cu), about 0.001 to 0.3 wt. % aluminum (Al), about 0.001% to 0.1 wt. % germanium (Ge), and balance of tin and unavoidable impurities. The tin-based solder ball has a high oxidation resistance.
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