Thin film photovoltaic assembly method
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United States of America Patent
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May 6, 2014
Grant Date -
Jan 12, 2006
app pub date -
Jul 12, 2004
filing date -
Jul 12, 2004
priority date (Note) -
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Abstract
The present invention relates to a method of manufacturing thin film photovoltaic panels (TFPP). Instead of utilizing a conventional EVA based adhesive layer, material, the present invention uses an adhesive layer that may be applied in a liquid form and cures rapidly to form the TFFP. In one embodiment, the method provides for applying an adhesive layer in a liquid form along at least a portion of the exposed photovoltaic layer and substrate. In another embodiment, the method provides for applying a first layer adhesive in liquid form along at least one edge of the substrate and second layer of adhesive in liquid form generally bound by the first layer of adhesive. After application of the adhesive layer(s), a force may then be applied to adhere the front panel (or substrate), photovoltaic material layer, adhesive layer and backing panel and the adhesive layer transforms from a liquid to a solid.
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