Resin composition, heat seal film and layered film
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United States of America Patent
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May 6, 2014
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app pub date -
May 27, 2011
filing date -
Jun 2, 2010
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Abstract
The present invention provides a resin composition including (1) at least one selected from the group consisting of ethylene-α,β-unsaturated carboxylic acid copolymers and ionomers thereof, which have a melt flow rate of from 0.5 g/10 min to 6 g/10 min, (2) at least one selected from the group consisting of ethylene-α,β-unsaturated carboxylic acid copolymers and ionomers thereof, which have a melt flow rate of from 10 g/10 min to 30 g/10 min, and (3) at least one selected from the group consisting of propylene homopolymers and copolymers obtained by copolymerization using propylene and one or more α-olefins excluding propylene, in which a structural unit derived from an α,β-unsaturated carboxylic acid ester is substantially not contained in the total amount of the ethylene-α,β-unsaturated carboxylic acid copolymers and the ionomers thereof.
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