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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
OCV INTELLECTUAL CAPITAL LLC	ONE OWENS CORNING PARKWAY TOLEDO OH 43659-0001

International Classification(s)

• B29C:SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTAN....
• B01J:CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS, CO....
• C08L:COMPOSITIONS OF MACROMOLECULAR COMPOUNDS

• [Classification Symbol]

• [Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Akagawa, Mitsuru	Ibaraki, JP	7	10
Yasuhara, Takuya	Tokyo, JP	6	35

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date
11.5 Year Payment	$7400.00	$3700.00	$1850.00	Nov 6, 2025

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge - 11.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
May 06, 2014	US,8715543,B2   US8715543B2	GRANTED PATENT AS SECOND PUBLICATION
October 04, 2012	US,20120248639,A1   US20120248639A1	FIRST PUBLISHED PATENT APPLICATION

Full Text

US Patent No: 8715543

Microencapsulated curing agent

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