Method for detaching and removing a semiconductor chip from a foil
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United States of America Patent
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May 6, 2014
Grant Date -
Sep 8, 2011
app pub date -
Nov 3, 2009
filing date -
Nov 12, 2008
priority date (Note) -
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Abstract
The detachment and removal of a semiconductor chip from a foil occurs in accordance with the invention in three phases. In the first phase there is a partial detachment of the semiconductor chip from the foil with mechanical means, but without the participation of a chip gripper. In the second phase the semiconductor chip is further detached from the foil, with the semiconductor chip being held by the chip gripper. In the third phase the chip gripper is lifted and moved away.
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