Laser-irradiated thin films having variable thickness
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United States of America Patent
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May 6, 2014
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app pub date -
Jan 14, 2013
filing date -
Sep 16, 2003
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Abstract
Systems for processing thin films having variable thickness are provided. A crystalline film includes a first crystalline region having a first film thickness and a first crystalline grain structure; and a second crystalline region having a second film thickness and a second crystalline grain structure. The first film thickness is greater than the second film thickness and the first and second film thicknesses are selected to provide a crystalline region having the degree and orientation of crystallization that is desired for a device component.
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