Method and system for cooling of integrated circuits

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United States of America Patent

PATENT NO 8711564
APP PUB NO 20120195006A1
SERIAL NO

13374780

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Abstract

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A system of motherboard, socket and convective cooling cells is providing cooling of both sides—top and bottom—of an integrated circuit, which keeps the temperature deviation inside circuit up to 4 times lower and is up to 4 times more efficient than at the cooling of the same circuit from only one of its side.

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Patent Owner(s)

Patent OwnerAddress
QUALITICS INCRICHMOND HTS OH

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Krasnov, Yuriy K Richmond Hts., US 5 13

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