Manufacturing method for semiconductor device carrier and semiconductor package using the same
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United States of America Patent
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Apr 29, 2014
Grant Date -
Mar 8, 2012
app pub date -
Aug 31, 2011
filing date -
Aug 31, 2010
priority date (Note) -
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Abstract
A conductive carrier having a first surface and a second surface is provided. The conductive trace layer is formed on the second surface of the conductive carrier. A conductive stud layer is formed on the conductive trace layer. A dielectric layer is formed on the conductive layer to encapsulate the conductive trace layer and the conductive stud layer. The conductive stud layer is exposed. A plating conductive layer is formed to envelop the conductive carrier, the dielectric layer and the exposed end of the conductive stud layer. A cavity is formed on the conductive carrier, wherein the conductive trace layer and the dielectric layer are exposed in the cavity. A surface finishing is formed on at least an exposed portion of the conductive stud layer. The plating conductive layer is removed.
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